Qualcomm introduced two new ones 5G modem of the next generation, the Snapdragon X75 & X72
Qualcomm's new modems are trying to keep the company ahead of the competition by offering support for the new 5G Advanced mmWave standard, with new improved AI capabilities (Ai), while at the same time offering improvement in connection speeds, better energy efficiency and high bandwidth usage in all bands of 3G / 4G and 5G networks.
After a rather lukewarm launch with the XXXUMX Snapdragon modem, which offered the same theoretical speeds as the previous one X65 but with a new AI processor, the new X75 modem brings new technologies, with increased speeds and 2,5x improvement in AI processing (Ai), including the first one tensor core to Smartphone modems.
New 5G Advanced technology (5.5G;)
Just like networking standards 2G, 3G and 4G (LTE) had their share of developments – e.g. we had a transition from UMTS > HSPA > HSPA+, LTE > LTE+ / 4G Advanced, so is the 5G got his own"Advanced specifications", which are still under development under the 3GPP version 18.
So, the news was announced by Qualcomm Snapdragon X75 Modem, which is characterized as “5G Advanced-ready', and is the first announced modem to include one Ai second generation processor.
As for the news 5G Advanced technology, acceleration through artificial intelligence (AI), is expected to improve network management and optimize connections both in speed and most importantly – in energy efficiency, making better use of multiple antennas available in most advanced devices, including augmented reality applications (XR). An example mentioned by Qualcomm is one up to 25% improvement in mmWave signal and even better location recording at GPS.
In terms of speed improvement, the Snapdragon X75 modem promises an improvement up to 50% of Uplink speeds, using both multi-link technology (multiple links) as well as carrier aggregation technology (carrier aggregation features). Download speeds will also be improved, and the new Snapdragon X75 modem will be the first to support the technology carrier aggregation with 5x improvement in connection speed below 6 GHz (sub-6) and 10x better speed on mmWave.
Better power management
A seemingly small change in X75 modem is the integration of mmWave and sub-6 transceivers. While in the past these circuits consisted of two different blocks inside the modem SoC, the new architecture merges these two blocks into one, which simplifies not only the diagrams, but brings many advantages in the required cost and the allocation of the space allocated in the devices for placing the components (something that will make manufacturers especially happy), but also better energy use for consumers.
The chart announced by Qualcomm for the Snapdragon X72 modem it is identical to the X75, offering almost the same advantages in terms of power management, but also about the download / upload speeds of mainstream devices.
Η Qualcomm expects that the Snapdragon X75 will be commercially available in OEM devices as a stand-alone Chip by second half of 2023. We also expect the same modem to be incorporated into Qualcomm's next-gen flagship which will apparently be the Snapdragon 8 Gen 3 SoC at the end of the year.
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