The MediaTek Dimensity 800 is intended for mid-range smartphones to be released by second quarter of 2020 and then.
Έa month after its presentation MediaTek Dimensity 1000, the first SoC of the company with a built-in 5G modem intended for high-end devices, MediaTek returns with the unveiling of the corresponding chipset for the value-for-money devices that we expect in 2020 from Chinese manufacturers.
The company revealed that MediaTek Dimensity 800 includes octa-core CPU with 4x ARM Cortex-A77 cores clocked at 2.6GHz and 4x ARM Cortex-A55 cores at 2.2GHz, ARM Mali-G77 MP9 GPU graphics processor and integrated 5G modem Helio M70 (4.7Gbps downlink, 2.5Gbps support for SA / NSA networks).
The MediaTek Dimensity 800 is intended for mid-range smartphones that will be released from the second quarter of 2020 onwards, since its mass production will start from the beginning of the year. If we could make a comparison with the little information that became known about its technical characteristics, the Dimensity 800 will be the competitor of the Snapdragon 765.
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