MediaTek has just announced its new chipset, which will be the Dimensity 6300 and is meant to be the follow-up to last year's Dimensity 6100+
The new Dimensity 6300 features the two main overclocked cores Cortex-A76 with timing speed at 2.4GHz instead of 2.2GHz. Along with the two of them Cortex-A76, there are six others Cortex-A55 with timing speeds at 2GHz.
Its construction Dimensity 6300 was held with 6nm manufacturing process by TSMC and has for Mali-G57 MC2 GPU. The MediaTek claims that the new SoC will offer a10% increase in CPU performance compared to last year Dimension 6100+.
Apart from the above features of the new SoC, it also has the technology UltraSave 3.0+ of MediaTek to save energy as well modem 5G compliant with the standard 3GPP Release 16.
As for the RAM and internal storage, supports the same technologies LPDDR4x and UFS 2.2 which we had seen in the previous SoC. It also supports maximum screen resolution at 1080 x 2520 pixels. Additional specifications include up to 108MP for the main cameras, dual-band Wi-Fi 5 (a/b/g/n/ac) and connectivity Bluetooth 5.2.
One of the first smartphones expected to feature the new Dimensity 6300, it's the Realme C65 5G which is expected to be released in late April.
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