Today, new leaks give us more information about the specifications of Mediatek's upcoming Dimensity 7000 SoC.
Η MediaTek revealed to us the top Dimensity 9000 SoC earlier this month, and at the same time we were informed that a more affordable version called Dimensity 7000.
What has become known is that this SoC will be based on the manufacturing process in 5nm FinFET from TSMC, and today new leaks give us more information about the specifications that will be coming Dimensity 9000 SoC.
According to the new information, the CPU will be divided into two groups of four nuclei each one. One group will operate with the clock clocked at 2,75 GHz and the other in 2,0 GHz.
The four strong cores will be type Cortex-A78, while the other four cores that will be dedicated to energy efficiency will be Cortex-A55. This CPU design is very similar to Dimensity 1200 SoC, but instead of having a layout 1 + 3 + 4, in the new SoC all four units with Cortex-A78 CPUs will have equal clock speed (4 + 4 layout).
Graphics will be handled by Mali-G510 MC6 GPU which was announced by ARM in early 2021, but this will be the first time we see it applied to a real chipset for smartphones.
The new Dimensity 7000 SoC will be intended for mid-range smartphone. The Mediatek has not officially announced anything yet, but rumors say that the devices that will be equipped with this SoC will be released by the first quarter of 2022.
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