Xiaomi Mi 9: Xiaomi President Lei Jun shares a Teardown of the device.

The Mi 9 became official several days ago, and today we have a teardown of the device, and the images you will see are official, by Xiaomi CEO Lei Jun.

Τteardown begins by removing the back cover of the device which is blue. And the first thing we see is the impressive wireless charging coil that provides 20W charging, and can complete a full charge in just 90 minutes.

Once the insulation material is removed from the motherboard, we see on the right the set of three rear cameras, while on the motherboard we see the internal parts of the device consisting of the integrated circuits of Snapdragon Soc, such as: SMB1390 Qualcomm Qualcomm, Qualcomm PM855 power management, Qorvo QM56023 as power amplifier, Qualcomm WCN3998 for WiFi and Bluetooth, and an IDT P9382A chip.

On the other side of the motherboard we find the powerful Qualcomm Snapdragon 855, the internal 2.1 UFS RAM of Samsung (SK Hynix LPDDR4), along with many chips for NFC, WiFi and Bluetooth.

Regarding the three cameras mentioned above, we see sequentially (from top to bottom), the ultra-wide angle lens with 16MP sensor SONY IMX481 and aperture f / 2.2, the main sensor of 48MP 1/2 ″ SONY IMX586 and aperture f / 1,75, and finally, the telephoto lens with 2x optical zoom that uses the sensor in the 12MP Samsung S5K3M5 with f / 2.2 aperture.

In the image below we can see the new SLS 1217 speaker with increased depth for louder sound and deeper bass. Next, we have the USB Type-C port with a plastic case to prevent dust ingress, as well as the Cirrus Logic chip used to enhance the sound power.

Finally, Lin Bin shows us the new fifth-generation fingerprint sensor below the screen. He is able to unlock the device up to 25% faster than previous generations, operating even at lower temperatures and in places with a lot of light.

We have to say that even in his heart, the Xiaomi Mi 9 seems to be impressive.

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