ΠXiaomi recently released the flagship Mi Mix 3 which also had a dual camera, but apparently the main camera of the upcoming Xiaomi Mi 9 will consist of three sensors. Supply chain sources said that the Xiaomi Mi 9, which will be released in the first half of 2019, will be equipped with its processor Qualcomm Snapdragon 8150 and is expected to be released in China.
Of course, a fingerprint sensor under the screen is expected to be used, support for wireless charging technology and some kind of protection from dust and moisture.
It is worth noting that Qualcomm is currently developing the latest generation processor, Snapdragon 8150, previously named Snapdragon 855.
This new Qualcomm Soc will be manufactured by TSMC using the 7-nanometer process, and will have a separate neural processor for Artificial Intelligence functions.
According to well-known consultant Roland Quandt, the architecture of the Snapdragon 8150 will be much better than that of Huawei Kirin 980.
Along with the Snapdragon 8150, the latest reports from WinFuture suggest, that a new set of SoCs mid-range, is in Qualcomm's next plans * (Snapdragon 6150 and 7150).
