Mi 10 Pro: See the official teardown of the device

Today Xiaomi in its own official teardown shows us its interior We 10 Pro with every detail.

ΣWith this disassembly (Teardown) of the device we will see the dual stereo speaker, the large size of the camera sensor at 108MP, the 5G modem 5G, and many more of the device components that we will see below.

As soon as his back is open We 10 Pro, the first thing we notice is that under the lid there are two rubber panels whose main purpose is to absorb the pressures in case of device fall.

Then what we find in the main body of the Xiaomi Mi 10 Pro is the NFC coil and the wireless charging base. In addition, in the same image, you can see the large size of the graphite heat-conducting plate, which has been added to improve the cooling of the device.

At each end of Xiaomi's new flagship, we found two stereo speakers mounted in a large 1.22cc audio cavity. It should be noted that this sound cavity is larger than that found in the simple Mi 10.

After removing the toner plate we can see the large battery housed inside the Mi 10 Pro. The battery, which has a total capacity of 4500mAh, occupies almost the entire height of the Smartphone, and on the left we find the motherboard where almost all the components of the device are housed.

In addition, as we see in the image above, the camera sensor at 108MP, shows us its large size compared to other sensors. Also, under these camera sensors, we can see the laser focus sensor and the LED flash.

At the front of the screen and below the small hole is the Selfie camera at 20MP, and note that this sensor has been specially designed to take up as little space as possible.

The next thing we find inside Xiaomi's flagship is the "L" shaped motherboard, covered with copper and graphite sheets, in order to improve heat dissipation. On this board it integrates essentially all the basic hardware, such as the different connection chips (Bluetooth & Wifi), the LPDDR5 RAM, the UFS 3.0 storage memory but also the powerful Snapdragon 865 SoC.

In addition, the motherboard is connected to an FPC (tape cable) on a second board that houses the Chips that are responsible for NFC and the controller. Similarly, on this secondary board, there is a chip that specializes in wireless charging, capable of improving the time required for wireless charging.

Finally, Xiaomi shows us the large VC (Steam Chamber) heat dissipation plate. This board has an area of ​​at least 3000 mm2 and is combined with a large number of temperature sensors located on the motherboard.

All the above features of the device allowed in Xiaomi Mi 10 Pro to achieve a high score in Master Lu (Chinese Benchmark), reaching the 469.692 units, and ranking the Mi 10 Pro in second place, right after Nubia Red Magic 3S, which with the Snapdragon 855+ received the score of 488,450 points.

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