An official video with the Teardown (disassembly) of the Redmi K40 Game Enhanced Version, which reveals to us how the device is made.
Το Redmi K40 Game Enhanced Version was officially released in China on April 27, and is equipped with the Dimensity 1200 SoC by Mediatek, with 6GB + 128GB and price at 1999 yuan (~ $ 398 / € 256).
This phone is specially designed for gaming, it is equipped with flat OLED screen with refresh rate of 120Hz, with independent antenna units, pop-up shoulder keys, X-axis linear feedback motor, stereo dual speakers tuned by JBL and other remarkable specifications, while at the same time managing to be slim and light.
The Redmi K40 GE uses a hexagonal boron nitride-coated cooling and heat dissipation system, which is mounted on the back of the device, and close to the main motherboard for better heat dissipation.
Although this Gaming Smartphone is very light and thin, with a thickness of just at 8,3 mm, also has a coil system for NFC but also an infrared transmitter (IR-Bluster).
In the video with the disassembly of the device, it appears that most of the screws of the phone are stuck, so that it can be easily identified after the sale if there are any traces of disassembly and breach that will of course have a negative effect on the warranty.
Once the motherboard and aperture above the camera have been removed, you can clearly see the entire Moule of the camera. The main camera of this phone is on 64MP which uses innovative ultra-low dispersion optical glass ED, and at the same time resin lens, to achieve a good result in the shots.
Removing the shield reveals all the components from the chip to Redmi K40, and we can see that it uses memory Samsung LPDDR4X RAM and chip UFS flash memory 3.1 of Samsung.
It should be noted that the Dimensity 1200 SoC is below memory and may not be immediately apparent.
In the middle of the phone case we see the position of the processor, which is covered with a cooling plate VC which covers a large area, and the top is coated with silicone grease for better heat treatment.
This method contributes to the rapid transfer of heat from the Dimensity 1200 SoC throughout the body of the phone, ensuring performance in games, keeping the temperature low.
As seen in the video, mlithium battery on Redmi K40 Game Enhanced Edition manufactured by Dongguan New Energy Technology Co., Ltd. (ATL), with password code BM56, with standard capacity in 5065mAh and nominal capacity in 4965mAh. The battery has two sets of cables to ensure high current charging current 67w.
In addition, the disassembly video shows a schematic diagram of the structure of the X-axis linear motor and the magnetic Pop-Up shoulder keys.
The improved version Redmi K40 uses one OLED flat screen which is made by the process COP, in which the cable and chip are folded at the back of the screen to achieve an extremely narrow bottom frame (chin) at 2,7 mm.
The phone started making its first Flash sales on 30 April, and exceeded 100.000 units in one minute.
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