The Redmi Product Manager, Wang Teng Thomas, now offers us a video of its disassembly K30 Pro, in which we see its impressive interior design.
ΑThis video is quite interesting for several reasons. As you may have already heard, the Redmi K30 Pro will pack the top class Snapdragon 865 SoC and will have support for 5G networks, which means that the device will have many large and complex antennas.
Also, inside the device there will of course be a hybrid battery in 4.700 mAh , with fast charging support on 33w. In addition to the above, in the device we will find a total of four basic camera units, two of which will be in 64MP (IMX686) which will also support visual stabilization (OIS). On the front of the device there will be a perfect OLED screen, but also the Selfie camera that will be mounted on a PoP-Up type mechanism periscope .
As you can see, all this requires a lot of space inside the device, and with the help of the video above we can see how the company managed to pack all this inside the device.
There could be no different solution from the motherboard type "sandwich" to distribute all the above materials in the smallest possible space. So the PCBs of the motherboard are not only extremely dense in terms of the chips they pack in the total area of their surface, but also the pieces of the motherboard themselves are also stacked on top of each other in a fairly clever way.
Another thing that this video reveals is the impressive cooling device that the K30 Pro has. This special cooling unit includes a larger special steam chamber housed inside a smartphone and measures 3,435 mm ².
The new Redmi K30 Pro is expected to hit the markets in late March, with 24i March be reported as the most probable date.
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