The iFixit team disassembled Xiaomi's Mi 11 and published its findings on how easily the device can be repaired.
Το My 11 Xiaomi received a repair ease rating 4/10, and is equal to its normal version Samsung Galaxy S21, but was well behind its four models iPhone 12 they received 6/10 Grading.
His team iFixit points out that the lack of IP certification (water and dust resistance) for the Mi 11, allowed Xiaomi to use less glue, which made it easier to remove the back cover and screen (which came out without cracks). The battery was also easy to remove with its special traction strips, and the screen and battery can be replaced separately, which greatly simplifies the whole process of repairing or replacing them if ever needed.
As stated in the relevant article published by iFixit, most circuits, such as the SoC and other device chips, are located under the large copper heatsink. Under the brush we will find it 888 Snapdragon SoC along with memory RAM LPDDR5 (3.200 MHz) from Samsung, while the storage chip UFS 3.1 by SK Hynix is right next to them.
The curved glass that surrounds the body of the Mi 11 is much more difficult to remove and requires special tools. Also because the fingerprint reader under the screen can only be replaced after the screen has been removed (but it may break).
Η USB-C port as well as the card reader SIMs. are welded, which makes them more difficult to replace.
So, overall My 11 snatched one moderate score, which indicates that special care is needed during its disassembly and repair.
You can read his full article iFixit HERE.
Do not forget to follow it Xiaomi-miui.gr on Google News to be informed immediately about all our new articles! You can also if you use RSS reader, add our page to your list by simply following this link >> https://news.xiaomi-miui.gr/feed/gn
Follow us on Telegram so that you are the first to learn our every news!
