Samsung has announced the successor to I-Cube2 technology that made its debut in 2018 - the I-Cube4 for faster and greater chip energy savings.
Η new technology I-Cube4 uses "new generation 2.5D technology" aimed at "high performance applications". THE Samsung states that the new technology offers greater efficiency and energy savings as well as other benefits. The new technology, according to the company, is immediately available.
The detailed description of the whole process
According to SamsungThe I-Cube4 is a heterogeneous integration technology that allows the horizontal placement of one logic die (CPU, GPU etc.) and four High Bandwidth Memory (HBM) dies over the silicon interposer, which allows the operation of multiple die on a single chip.
With this placement, the I-Cube4 claims to provide faster communication between logic die and HBM as well as greater energy savings. The company states that the new technology is ideal for high-performance computing (HPC) applications such as AI, 5G, cloud and adults data centers.
The press release states that the silicon interposer is thinner than paper, which makes it vulnerable to distortions and bends, negatively affecting the quality of the product. However, the Samsung claims that it can control the distortion and thermal expansion of the interposer by changing the material and thickness.
Its structure I-Cube4 is made as "mold-free" which effectively removes heat. Also, the Samsung will conduct pre-screening tests which will filter the defective units, thus increasing their output. All of these optimizations, according to the company, led to the commercialization of I-Cube4.
Samsung has also started developing the I-Cube6
Beyond his announcement I-Cube4, Samsung also announced that it has begun its development I-Cube6 who will be his successor I-Cube4. It I-Cube6, will feature a "combination of advanced process nodes, high-speed IPs interfaces and advanced 2.5 / 3D packaging technologies, which will help consumers design their products in the most efficient way".
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