The first Smartphone in the world to wear it Snapdragon 888 is already official since yesterday in China, with the release of Mi 11 by Xiaomi .
Η Xiaomi's brand new flagship quickly reached the hands of local tech bloggers, and experts from Aiao Technology decided to disassemble it (Teardown) and show us what it looks like inside.
As with all teardowns, disassembly begins by removing it sim tray located at the bottom of the device and near the USB-C port. Immediately after it is time to open the back of the device which is covered with eco-leather and remove some screws that hold the camera sensor cover.
The main sensor of 108MP It is Samsung ISOCELL HMX which has optical stabilization (OIS), in combination with a sensor Samsung S5K5E9 at 5MP for Macro camera and finally we find the ultra-wide angle lens that has the sensor OMniVision CMOS OV13B10 at 13MP.
Xiaomi Mi 11 teardown (Credits: Aiao Technology)
The motherboard is covered with plenty of copper foil on the front and back and also has several heat sinks for improved thermal efficiency. After removing the pieces of copper, we can really see the brand new Snapdragon chipset 888 together with the flash memory, which are tightly sealed and welded to protect against exposure to liquids.
Their battery 4.600 mAh provided by Sunwoda Electronics Co Ltd.
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