Η MediaTek announced the news today Dimension 900 5G SoC which is made with lithography technology in 6nm from TSMC, like the Dimensity 1000 and 1200.
Δhas support in Wi-Fi networks 6, screen support FHD + with a renewal rate of 120Hz and support for main camera in 108MP.
The new Dimension 900 5G SoC has 5G modem New Radio (NR) with support at sub-6GHz carrier aggregation. It also supports two completely independent Dual 5G SIM cards (5G SA + 5G SA) and Voice over New Radio (VoNR) with support for up to 120MHz.
In the heart of the central processing unit by one CPU with eight cores, consisting of two processors Arm Cortex-A78 at clock speeds up to 2,4GHz and six cores Arm Cortex-A55 operating up to 2GHz.
The chipset has a for graphics processing unit Arm Mali-G68 MC4 (GPU), together with an independent artificial intelligence processing unit (Ai) (APU). The 3rd generation of the processing unit Ai of MediaTek supports a wide variety of Ai applications and high definition resolution on 4K (HDR).
In the state-of-the-art technologies integrated into Dimensity 900 included :
- MediaTek's Image 5.0 : The chipset incorporates a flagship HDR video signal processor (ISP) capable of recording video in 4K HDR with hardware acceleration. This ISP Chip simultaneously supports up to four camera sensors and a sensor with a maximum resolution of 108MP.
- MediaTek's MiraVision: The chipset includes upgraded video recording capabilities with a standard dynamic range (SDR) to HDR and real-time enhancements for HDR10 + video playback, as well as color enhancement and content contrast capabilities.
The specifications of the Dimensity 900 in relation to the Dimensity 1100
| Dimensity 900 | Dimensity 1100 | |
| Our Process | 6nm TSMC | |
| CPU | 2x Cortex-A78 @ 2.4GHz 6x Cortex-A55 @ 2GHz |
4x Cortex-A78 @ 2.6GHz 4x Cortex-A55 @ 2GHz |
| Memory | LPDDR4x, LPDDR5, UFS 2.1, UFS 2.2, UFS 3.1 | 2X LPDDR4x, up to 16GB, dual-channel UFS 3.1 |
| Camera | 20MP + 20MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine | 32MP + 16MP, 108MP, Multi-Camera, HDR-ISP (3 + 2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD |
| Display | 2520 x 1080 (Full HD +) at 21: 9 120Hz | 2520 x 1080 (Full HD +) at 21: 9 144Hz, QHD + at 90Hz |
| Video Playback / Video Encode | H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC | |
| Graphics | Mali-G68 MC4 | Mali-G77 MC9 |
| Modem | True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4 × 4 MIMO, 256QAM NR UL 2CC, 2 × 2 MIMO, 256QAM VoNR / EPS fallback | |
| Connectivity | Integrated Wi-Fi 6 (a / b / g / n / ac / ax), Bluetooth 5.2, GPS L1CA + L5 / BeiDou B1I + B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA + L5 / NavIC | |
The first devices to be powered by Dimensity 900 SoC by MediaTek, are expected to be released to the world market in the second quarter of 2021.
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