After many rumors that circulated recently, the MediaTek officially presented today the Dimensity 8200, new SoC of the company belonging to series 8000
The new Dimensity 8200 is the direct successor to the Dimensity 8100, and uses the lithography process at 4nm, offering improved power efficiency compared to Dimensity 5's 8100nm.
It has a single-core octa-core CPU Arm Cortex-A78 prime with a clock frequency of up to 3,1 GHz, three performance cores Arm Cortex-A78 at 3,0 GHz and four cores Arm Cortex-A55 at 2,0 GHz maintaining it Mali-G61 chip for the GPU.
It has the new technology Hyper Engine 6.0 that offers smooth Gaming without interruptions in the connection, Gaming that is free from the FPS jitter and hiccups, while technology Intelligent Display Sync 2.0 which it has, intelligently adjusts the screen refresh rate according to the frame rate of the game, which helps to provide smoother Frames when viewing. The new 8200 SoC maintains the 580 . APU (MediaTek's 5th generation AI processor).
There is also a built-in and Imagiq 785 ISP, which supports photos in 320MP, HDR video at 14-bit on up to three cameras at the same time, but also the recording Cinema video with dual camera shooting for the most natural bokeh effect.
It has built-in 5G modem with the latest technology 3GPP Release-16 and 3CC carrier aggregation to enhance performance in sub-6GHz. The chipset also supports the tri-band Wi-Fi 6E with 2×2 antennas.
MediaTek Dimensity 8200 Specifications
| Dimensity 8100 | ||
| TSMC N4 (4nm-class) | ||
| CPU | 1x Cortex-A78 @ 3.1GHz 3x Cortex-A78 @ 3.0GHz 4x Cortex-A55 @ 2GHz |
|
| Memory | quad-channel LPDDR5 6400Mbps, dual-channel UFS 3.1 | |
| Camera | Imagiq 785 ISP, 320MP, 32+32+32MP, Simultaneous dual camera HDR video recording, 5Gbps 14-bit HDR-ISPs / Video HDR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI- AWB / AI-NR HDR / AI-HDR / AI-FD | |
| Display | FHD+ @ 180Hz / WQHD+ @ 120Hz | |
| Video Playback / Video Encode | H.264, HEVC, VP-9, AV1 / H.264, HEVC, 4K60 HDR10+ | |
| Graphics | Arm Mali-G610 MC6 | |
| Modem | 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA
5G/4G Dual SIM Dual Standby, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 2CC, 200MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback |
|
| Connectivity | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.3, GPS L1CA+L5 / BeiDou B1I+ B2a + B1C / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC | |
Availability
The MediaTek Dimensity 8200 will be released to the global market by December of 2022. The iQOO Neo7 SE to be unveiled later today will be the first phone to use this SoC. THE Xiaomi also confirmed that it will use Dimensity 8200 in the upcoming smartphone Redmi K60E.
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